Dennis,

Good to see from you again though your subject sucks. You know exactly what
to do and what not.

I'm fighting the same battle right now with some young engineers and
designers. I did some of the first simple minded studies on BGA's with vias
in pads many years ago. The solder goes away and you and everyone else knows
it. Micro vias down about 4 mils are ok provide proper compensation is made
for solder volume and the avoidance of outgassing.

I've got some folks wanting to take a blind via down about 18 mils and just
see what happens. Wow, will this never end.

You know I respect you babe,

MoonMan

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