Unbelievable.

Just last month, you may recall, we discussed warping in a particular type
of BGA package. A TechNet subscriber gave me a POC at the semi-conductor
manufacturer (not listed as subscribing to the NEDA paper). The very first
thing the package designer asked for was the country and date codes. Given
those to data points the semiconductor manufacturer was able to identify the
materials and processes used to create the package, the root cause of the
OEM problems and suggest corrective action.

The components inside the bag undoubtedly were marked but can you imagine if
the components in these bags were of mixed origin and/or date of
manufacture.



> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of [log in to unmask]
> Sent: Tuesday, April 30, 2002 11:14 PM
> To: [log in to unmask]
> Subject: [TN] A "NEDA" Oriented label...
>
>
> Was given a image of a label on packaging that's out there as we speak, as
> something that would be more wide-spread if NEDA has their way...go to:
>
> http://www.stevezeva.homestead.com
>
> and look at NEDA label.jpg...
>
> Really helps, doesn't it?
>
> -Steve Gregory-

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