Please

During the Cross Section analysis of a BGA we found two solder bumps almost
touching each other by the formation of something that look like "solder
spikes". Could someone help me to identify the causes.
The problem is in the reflow process or solder bumps before reflow? or
could it be some other reason?

I have a picture of the problem but I don't know how to send to the Forum!

Thanks

Antonio
Brasil

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