Hello Technet:
We're starting to design a 6 layer SMT board, which is 1" x 2".  The
assembly will include flip-chips on both sides (maybe 10 total), along with
a number of resistors and caps.  The board will most likely include blind
and buried vias.  The material might be FR-4, or maybe polyimide.  The
pallet will probably be combined routing and scoring.  (I'm trying to guess
what other information might be needed.)  Anyway, my question is how far
from the edges do I need to keep the component?  Flip-chip?  Chips?

Thanks,
 Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879

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