Hi Larry,
We remove and replace 35mm ceramic BGAs from assemblies which are bonded to
a .188" aluminum composite core using an Air-Vac system.  Standard Sn63
solder paste is used.  Not something I like doing, but it can be done.

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879


        -----Original Message-----
        From:   Jindra, Larry [SMTP:[log in to unmask]]
        Sent:   Monday, May 06, 2002 7:24 PM
        To:     [log in to unmask]
        Subject:        [TN] Low Temp BGA Balls

        I've got a module with PCAs bonded to both sides of an .100"
aluminum heatsink.  A 35mm BGA needs replacement.  Does someone out there
have experience with using low-temp solder balls on BGAs, or should I file
this away under R for Rube Goldberg?


        Larry Jindra
        Mfg Engr Group Lead
        TRW Radio Systems
        [log in to unmask]
        w) 858-592-3424
        f)  858-592-3940


----------------------------------------------------------------------------
-----
        Technet Mail List provided as a free service by IPC using LISTSERV
1.8d
        To unsubscribe, send a message to [log in to unmask] with following
text in
        the BODY (NOT the subject field): SIGNOFF Technet
        To temporarily halt delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL
        To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
        Search the archives of previous posts at:
http://listserv.ipc.org/archives
        Please visit IPC web site http://www.ipc.org/html/forum.htm for
additional
        information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315

----------------------------------------------------------------------------
-----

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------