I've got a module with PCAs bonded to both sides of an .100" aluminum heatsink.  A 35mm BGA needs replacement.  Does someone out there have experience with using low-temp solder balls on BGAs, or should I file this away under R for Rube Goldberg?


Larry Jindra
Mfg Engr Group Lead
TRW Radio Systems
[log in to unmask]
w) 858-592-3424
f)  858-592-3940

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