At 11:06 AM 5/6/2002 -0700, Jana Carraway wrote:
>I'm wondering what manufacturing facility in Costa Mesa is 100,000 sq feet
>and has 40,000 sq feet of clean rooms...sounds like the old Litronic
>building in Cost Mesa?
Yep. The ASTI facility. Allied gutted the Litronic facility and built a
really amazing capability there before they abandoned the money pit to Sanmina.
>Hope potential customers know there is a big
>learning curve with flex...
>Jana Carraway
>Portland, Oregon
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]]On Behalf Of Earl Moon
>Sent: Monday, May 06, 2002 7:59 AM
>To: [log in to unmask]
>Subject: [TN] HDI and Sanmina
>
>
>May I ask of you all your familiarity with this operation. I am not a
>Sanmina fan going way back with Jure and Milan in the '80's. I've just lost
>interest in their Hadco capability that used to be top notch. The following
>was recently read in Jeff's fine rag:
>
>Sanmina-SCI Announces High Density Flexible Circuit Capability
>PR Newswire (May 2, 2002)
>
>SAN JOSE, Calif., May 2, 2002 /PRNewswire-FirstCall via COMTEX/ --
>Sanmina-SCI Corporation (Nasdaq: SANM), a leading global electronics
>contract manufacturer and high performance printed circuit board (PCB)
>fabricator, today announced it is producing high density interconnect (HDI)
>multi-layer flexible printed circuit boards at its HDI manufacturing and
>research center in Costa Mesa, California. Multi-layer flexible circuits
>allow for very high wiring densities on very thin boards which can then be
>bent or folded to fit into tight spaces. The additional capability supports
>customer requirements for leading edge, cost-effective technology for high
>performance products.
>
>George Dudnikov, Sanmina-SCI's Senior Vice President and Chief Technology
>Officer for Printed Circuit Board Fabrication, said, "The 100,000 square
>foot Costa Mesa facility, one of the most advanced PCB factories in the
>world, is designed with the specialized infrastructure necessary for
>manufacturing the highest complexity HDI products. Virtually
>all-manufacturing operations are performed within a 40,000 square foot
>general Class 10,000 clean room environment. Class 1000 and 100
>environments, similar to the type available in semiconductor fabs, are used
>for critical process steps such as photolithography, circuit formation and
>plating. Sanmina-SCI is the only PCB manufacturer in North America to have
>such an extensive level clean room facility. This infrastructure, which is
>paramount to obtaining high yields when manufacturing high density,
>ultra-fine line products, supports our opto-electronic PCB research and
>development efforts."
>
>Commenting further, Dudnikov said, "One of the key enabling technologies of
>the Costa Mesa factory is the ability to handle thin polyimide or LCP
>(liquid crystal polymer) film cores down to 25 microns (1 mil) in thickness.
>Additional capabilities include vacuum sputtered metal deposition of seed
>chrome and copper, laser-formed blind and buried vias down to 50-micron
>diameter, and buried passive components (resistors and capacitors) utilizing
>patented technologies. Circuit features can be as low as 25-micron (.001")
>trace widths. Semiconductor packaging type processes include flip chip and
>gold wire bond assembly technologies. Many of the company's Costa Mesa
>customers are focusing on new product applications for the high performance
>medical, opto-electronic, and wireless RF module markets."
>
>Jim Ryan, Vice President and General Manager of the Cost Mesa factory, said,
>"We are pleased with the interest we are seeing in our advanced capabilities
>for HDI product, especially in HDI flex products. As a result, many of our
>new product programs are very technically complex and cannot easily be moved
>offshore for production. In addition because of our ability to provide
>finished PCBs and flex circuits with ultra low surface ionics, we are
>successfully supporting our medical assembly operation. Our business is also
>expanding due to the increase in chip on flex (COF) requirements and our
>multiple gold finish capabilities for wire bonding. We also plan on
>broadening our capabilities into rigid flex products for medical
>applications and military avionics."
>
>
>Who's 100,000 sq foot facility was this and how many people going this way,
>please?
>
>MoonMan
>
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