Earl,
When is a connector determined to be "high density" type?
David A. Douthit
Manager
LoCan LLC
Earl Moon wrote:
> May I ask of you all your familiarity with this operation. I am not a
> Sanmina fan going way back with Jure and Milan in the '80's. I've just lost
> interest in their Hadco capability that used to be top notch. The following
> was recently read in Jeff's fine rag:
>
> Sanmina-SCI Announces High Density Flexible Circuit Capability
> PR Newswire (May 2, 2002)
>
> SAN JOSE, Calif., May 2, 2002 /PRNewswire-FirstCall via COMTEX/ --
> Sanmina-SCI Corporation (Nasdaq: SANM), a leading global electronics
> contract manufacturer and high performance printed circuit board (PCB)
> fabricator, today announced it is producing high density interconnect (HDI)
> multi-layer flexible printed circuit boards at its HDI manufacturing and
> research center in Costa Mesa, California. Multi-layer flexible circuits
> allow for very high wiring densities on very thin boards which can then be
> bent or folded to fit into tight spaces. The additional capability supports
> customer requirements for leading edge, cost-effective technology for high
> performance products.
>
> George Dudnikov, Sanmina-SCI's Senior Vice President and Chief Technology
> Officer for Printed Circuit Board Fabrication, said, "The 100,000 square
> foot Costa Mesa facility, one of the most advanced PCB factories in the
> world, is designed with the specialized infrastructure necessary for
> manufacturing the highest complexity HDI products. Virtually
> all-manufacturing operations are performed within a 40,000 square foot
> general Class 10,000 clean room environment. Class 1000 and 100
> environments, similar to the type available in semiconductor fabs, are used
> for critical process steps such as photolithography, circuit formation and
> plating. Sanmina-SCI is the only PCB manufacturer in North America to have
> such an extensive level clean room facility. This infrastructure, which is
> paramount to obtaining high yields when manufacturing high density,
> ultra-fine line products, supports our opto-electronic PCB research and
> development efforts."
>
> Commenting further, Dudnikov said, "One of the key enabling technologies of
> the Costa Mesa factory is the ability to handle thin polyimide or LCP
> (liquid crystal polymer) film cores down to 25 microns (1 mil) in thickness.
> Additional capabilities include vacuum sputtered metal deposition of seed
> chrome and copper, laser-formed blind and buried vias down to 50-micron
> diameter, and buried passive components (resistors and capacitors) utilizing
> patented technologies. Circuit features can be as low as 25-micron (.001")
> trace widths. Semiconductor packaging type processes include flip chip and
> gold wire bond assembly technologies. Many of the company's Costa Mesa
> customers are focusing on new product applications for the high performance
> medical, opto-electronic, and wireless RF module markets."
>
> Jim Ryan, Vice President and General Manager of the Cost Mesa factory, said,
> "We are pleased with the interest we are seeing in our advanced capabilities
> for HDI product, especially in HDI flex products. As a result, many of our
> new product programs are very technically complex and cannot easily be moved
> offshore for production. In addition because of our ability to provide
> finished PCBs and flex circuits with ultra low surface ionics, we are
> successfully supporting our medical assembly operation. Our business is also
> expanding due to the increase in chip on flex (COF) requirements and our
> multiple gold finish capabilities for wire bonding. We also plan on
> broadening our capabilities into rigid flex products for medical
> applications and military avionics."
>
> Who's 100,000 sq foot facility was this and how many people going this way,
> please?
>
> MoonMan
>
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