How do you reliably reach the 30 mils depth with a laser? or are you using
something else than inches in your statement?

Alain

-----Original Message-----
From: tony steinke [mailto:[log in to unmask]]
Sent: May 29, 2002 4:10 PM
To: [log in to unmask]
Subject: Re: [TN] conductive blind via plug


Don, Russ, Rush
The application is a blind via under BGA pad. The process sequence is:
Lase via
electroless
full panel electroplate
CB100(lase vias only)
flash electroplate
drill
electroless
image
pattern plate
strip/etch
Thanks for the input.
Tony Steinke


----- Original Message -----
From: Don  <mailto:[log in to unmask]> Vischulis
To: tony  <mailto:[log in to unmask]> steinke
Sent: Wednesday, May 29, 2002 9:49 AM
Subject: RE: [TN] conductive blind via plug

Tony,

Please supply process details.  The manufacturing sequence may be part of
the root problem.

Don Vischulis
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of tony steinke
Sent: Wednesday, May 29, 2002 11:33 AM
To: [log in to unmask] <mailto:[log in to unmask]>
Subject: [TN] conductive blind via plug


Techies,
We have done some initial testing on the  DuPont CB100 conductive via plug
with blind via application and so far have been unsuccessful. The blind via
is approximately .016 diameter and .030 in depth. The biggest problem we are
experiencing is getting adhesion(BGA pads popping off) with
copper plating after the CB100 has been applied. Is there
another type of conductive blind via plug recipe on the market.
Thanks for any comments
Tony Steinke

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