Please describe the process steps you are currently using to build the
boards.

Russ


>From: tony steinke <[log in to unmask]>
>Reply-To: "TechNet E-Mail Forum." <[log in to unmask]>,   tony steinke
><[log in to unmask]>
>To: [log in to unmask]
>Subject: [TN] conductive  blind via plug
>Date: Wed, 29 May 2002 09:33:28 -0700
>
>Techies,
>We have done some initial testing on the  DuPont CB100 conductive via plug
>with blind via application and so far have been unsuccessful. The blind via
>is approximately .016 diameter and .030 in depth. The biggest problem we
>are experiencing is getting adhesion(BGA pads popping off) with
>copper plating after the CB100 has been applied. Is there
>another type of conductive blind via plug recipe on the market.
>Thanks for any comments
>Tony Steinke



_________________________________________________________________
Join the world’s largest e-mail service with MSN Hotmail.
http://www.hotmail.com

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------