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May 2002

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 29 May 2002 07:50:24 -0400
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Was cleaning up my email, noticed nobody had responed to your request.
Here is a link,
http://www.circuitree.com/CDA/ArticleInformation/features/BNP__Features__Ite
m/0,2133,2133,00.html
I wonder if the work resulted in anything.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Jim Lamb
> Sent: Wednesday, May 15, 2002 3:14 AM
> To: [log in to unmask]
> Subject: [TN] Looking for recent PCB Reliability model
>
>
> Hi, I am looking for a Rigid printed circuit board reliability model
> that is more recent than the MIL-217 or AT&T model. It would include
> factors for blind and buried vias as well as soldered and unsoldered
> through holes and surface mount solder joints. Usually there is also a
> board complexity factor based on the number of layers.
>
> Any suggestions on where to look would be appreciated.
>
> Jim Lamb
>
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