TECHNET Archives

May 2002

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Earl Moon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 28 May 2002 07:35:14 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (26 lines)
Daan,

I'm sure in your mind the paste isn't the problem. Is it the usual
contamination or oxidation?

I would like to see some x-sections, both vertically and horizontally, of
the board to see if outgassing came from the filled and plated over holes.
50% voiding, though significant in terms of the solder joint, is not that
excessive relative to hole outgassing but I'd still like to see some
sections as this could be analog to hole wall outgassing in through holes.

Enjoy the adventure but hope it's not to much of a bad ride,

Earl

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2