Mike
Your info is not quite correct.
Consider: Running cost for latest VP system as my message described is
<US$2 per hour including capital amortisation. Air may be free, but
electricity isn't and nor is Nitrogen.
Regards Graham Naisbitt
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> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Mike Fenner
> Sent: Monday, May 27, 2002 14:20
> To: [log in to unmask]
> Subject: Re: [TN] SV: [TN] Vapor phase
>
>
> Brian:, its not the dissolved oxygen so much as the fact the
> vapour doesn't displace all the air.
>
> Björn: At the risk of being pedantic, an advantage of
> saturated vapour phase, and a principal factor in its
> original introduction for back plane soldering, and
> subsequent adoption in surface mount, is its ability to heat
> very uniformly almost irrespective of work size or geometry.
> This uniformity allows ramp rates which are much higher than
> is possible with other mechanisms for heat transfer.
>
> Anyone: However VPR heat transfer fluids are more expensive
> than, and clearly have an environmental impact which is
> greater than, the most common alternative medium used in
> conventional reflow ovens. Air is free :)
>
> The process advantages of VPR - which I fully appreciate -
> have to be set against its costs and disadvantages on a case
> by case basis. IMHO I think that this sort of analysis will
> show that for odd geometries heavy parts mixed prototyping
> etc, and for adhesive [epoxy] curing, saturated VPR has some
> attractions. Certainly it's a process which is hard to get
> wrong on one offs, but its harder to get really optimum on
> longer runs.
>
>
> Kind Regards
>
> Mike Fenner
>
> Applications Engineer, European Operations
> Indium Corporation
> T: + 44 1908 580 400
> M: + 44 7810 526 317
> F: + 44 1908 580 411
> E: [log in to unmask]
> W: www.indium.com
> Leadfree: www.Pb-Free.com
>
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Brian Ellis
> Sent: Monday, May 27, 2002 10:11 AM
> To: [log in to unmask]
> Subject: Re: [TN] SV: [TN] Vapor phase
>
>
> Björn
>
> There are VP reflow systems with controlled preheating,
> either using secondary fluids or IR. It is not necessary to
> put cold components in vapour at 215°C or more.
>
> Brian
>
> Björn Kullman wrote:
> >
> > True about not being able to overheat components, but, consider the
> > fast ramp-up that the majority (all?) of vapour phase ovens
> produce.
> > Components sensitive to temperature changes above 4 deg/sec
> are liable
> > to damage.
> >
> > Björn Kullman
> >
> > Sincotron Technology Center, Norrköping, Sweden
> > Sincotron Sverige AB www.sincotron.se
> > phone +46 (0)11-368288 mobile +46 (0)70-4245607
> >
> > -----Ursprungligt meddelande-----
> > Från: TechNet [mailto:[log in to unmask]]För Brian Ellis
> > Skickat: den 25 maj 2002 08:06
> > Till: [log in to unmask]
> > Ämne: Re: [TN] Vapor phase
> >
> > Mike
> >
> > It's true that PFCs do dissolve oxygen but the quantity in
> the vapour
> > phase is sufficiently low that no significant oxidation will occur,
> > unlike non-controlled atmospheric convection or IR soldering.
> > Milder/less flux can be used.
> >
> > The advantage over convection is that 3-D assmeblies are
> much easier
> > to solder and, being asymptotic, the process is less liable
> to damage
> > components which are very thermally sensitive because it is
> impossible
> > to exceed the vapour temperature which is fixed by the chemical
> > composition.
> >
> > Brian
> >
> > > Stefano Riccardi wrote:
> > >
> > > Hi all!
> > > We are currently looking for the assembling of a double
> side SMT -
> > > one side THT (High pin count connectors) board, with a
> lot of BGA.
> > > An assembler proposed us the use of vapor Phase reflow soldering.
> > > Any comment about this method? Can someone tell me where
> I can find
> > > informations (books, www,
> > > publications) about the vapor phase soldering?
> > >
> > > Thanks!
> >-
>
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