True about not being able to overheat components, but, consider the fast
ramp-up that the majority (all?) of vapour phase ovens produce. Components
sensitive to temperature changes above 4 deg/sec are liable to damage.

Björn Kullman

Sincotron Technology Center, Norrköping, Sweden
Sincotron Sverige AB                    www.sincotron.se
phone +46 (0)11-368288 mobile +46 (0)70-4245607

-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]]För Brian Ellis
Skickat: den 25 maj 2002 08:06
Till: [log in to unmask]
Ämne: Re: [TN] Vapor phase


Mike

It's true that PFCs do dissolve oxygen but the quantity in the vapour
phase is sufficiently low that no significant oxidation will occur,
unlike non-controlled atmospheric convection or IR soldering.
Milder/less flux can be used.

The advantage over convection is that 3-D assmeblies are much easier to
solder and, being asymptotic, the process is less liable to damage
components which are very thermally sensitive because it is impossible
to exceed the vapour temperature which is fixed by the chemical
composition.

Brian

> Stefano Riccardi wrote:
>
> Hi all!
> We are currently looking for the assembling of a double side SMT - one
> side THT (High pin count connectors) board, with a lot of BGA.
> An assembler proposed us the use of vapor Phase reflow soldering.
> Any comment about this method?
> Can someone tell me where I can find informations (books, www,
> publications) about the vapor phase soldering?
>
> Thanks!

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