Dependent on the pad termination geometry (most mfr recommendations have the
pad totally under the component), the bottom only termination may be the
correct correlation.  But, if the pad is larger (extends beyond the
component flange -- which is what I prefer) than the comonent termination
area then both bottom only and flat lug should suffice.

-----Original Message-----
From: Guy Ramsey [mailto:[log in to unmask]]
Sent: Thursday, May 23, 2002 10:33 AM
To: [log in to unmask]
Subject: Re: [TN] D2PAK devices


I expect to see a fillet that complies with the requirements for a bottom
only termination.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Reid, Lorraine
> Sent: Thursday, May 23, 2002 7:41 AM
> To: [log in to unmask]
> Subject: [TN] D2PAK devices
>
>
> Can the learned people at Technet please advise on solder
> acceptance guidelines for D2PAK devices?

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