There were a couple of papers presented at the most recent APEX conference
that may help you:

Manufacturing Process Considerations for Wireless Products by Anton Krycuk and Charles Patterson, Manufacturers' Services, Ltd.
Salt Lake City, UT

RF Characterization of No-clean Solder Fluxes and Other SMT Materials by Michael J. Liberatore, Alpha Metals, Jersey City, NJ

Quantifying Parasitic Induced by No-Clean Solder Paste Residue at RF Frequencies by Jackie Csonka-Peeren and John Scharkov,
Celestica International Inc., Ontario, Canada

They should be in the APEX proceedings or you can contact the authors directly.

Doug Pauls
Rockwell Collins

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