LISTSERV - TECHNET Archives - LISTSERV.IPC.ORG

TECHNET Archives

May 2002

TechNet@IPC.ORG

	LISTSERV Archives
	TECHNET Home
	TECHNET May 2002

	Log In
	Register

	Subscribe or Unsubscribe

	Search Archives

Options:	Use Monospaced Font Show Text Part by Default Show All Mail Headers
Message:	[<< First] [< Prev] [Next >] [Last >>]
Topic:	[<< First] [< Prev] [Next >] [Last >>]
Author:	[<< First] [< Prev] [Next >] [Last >>]

Subject:	Re: BGA Solderability
From:	rgrant <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Thu, 23 May 2002 12:47:41 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (48 lines)

Earl,  you will notice practically all PBGAs use SMDPs on the BT laminate
(package side).  One can presume this is to improve yields during BGA
package assembly by keeping the solder balls from rolling off their pad
before attachment.

Ryan Grant

-----Original Message-----
From: Earl Moon [mailto:[log in to unmask]]
Sent: Thursday, May 23, 2002 11:05 AM
To: [log in to unmask]
Subject: Re: [TN] BGA Solderability


Totally agree with you on SMDP's. Did much work on this in earlier days and
concur about stress. Question I always ask is why, but for this situation
though not needed as such, does anyone use solder mask defined pads for
anything?

Earl

----------------------------------------------------------------------------
-----
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET
Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
----------------------------------------------------------------------------
-----

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2

LISTSERV.IPC.ORG