It's time to "Fire Up for IPC's Annual Meeting."   Join us November 3-7, 2002 at the Hyatt Regency New Orleans.  For the second year in a row, you'll have a chance to increase your technical knowledge of the PCB and EMS industry, network with your peers and get a better understanding of market trends and how the industry is shaping up. 

This year's technical theme "Next Generation Interconnecting and the Hole Truth of High Density Interconnects", consists of sessions that include a variety of paper presentations and panel discussions on:
·     Via plating and hole fill technology
·     Alternatives to HASL from the OEM, EMS, manufacturer and supplier perspective
·     Advances in embedded passives
·     Obstacles to implementing optoelectronics in telecommunications
·     Going 3D -- folder and stacked die technologies revolutionize CSP products
·     IPC's 2002/2003 National Technology Roadmap
·     Signal integrity innovations

Interested in sharing your expertise on these or other related subjects?   You still have time to sign up to lead a technical session or present a paper.  The deadline for abstract and workshop proposals is June 1, 2002.   You can submit your information online quickly and easily through the link provided below.    And, presenters receive FREE conference admission!  Contact [log in to unmask] for more information.

Be sure to visit www.ipc.org and look under "Events and Projects" for the link to IPC's Annual Meeting and Technical Conference.   You'll see the latest hotel/travel and updated meeting information.  You can even register online.  

We look forward to seeing you next November!    





John Perry
Technical Project Manager
IPC
2215 Sanders Road
Northbrook, Il 60062
1-847-790-5318 (P)
1-847-509-9798 (F)
[log in to unmask]

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