I expect to see a fillet that complies with the requirements for a bottom
only termination.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Reid, Lorraine
> Sent: Thursday, May 23, 2002 7:41 AM
> To: [log in to unmask]
> Subject: [TN] D2PAK devices
>
>
> Can the learned people at Technet please advise on solder
> acceptance guidelines for D2PAK devices?
>
> Obviously the pair of leads (at what I will call the front edge
> of the device)  are treated as any leaded device in respect of
> the acceptability criteria of IPC-A-610, but what should the
> "plate" at the back be treated as?
>
> We have a situation where the pad design is just undersize for
> the component to be fitted - if we allow the front leads to
> overhang their pads, then we would accept this as "toe overhang"
> which does not violate minimum electrical clearance, but I am
> unsure as to what set of guidelines best applies to the lead at
> the rear of the device.
>
> I hope I have explained this OK.
>
> thanks
>
> Lorraine Reid

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