Can the learned people at Technet please advise on solder acceptance guidelines for D2PAK devices?

Obviously the pair of leads (at what I will call the front edge of the device)  are treated as any leaded device in respect of the acceptability criteria of IPC-A-610, but what should the "plate" at the back be treated as?

We have a situation where the pad design is just undersize for the component to be fitted - if we allow the front leads to overhang their pads, then we would accept this as "toe overhang" which does not violate minimum electrical clearance, but I am unsure as to what set of guidelines best applies to the lead at the rear of the device.

I hope I have explained this OK.

thanks

Lorraine Reid

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