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May 2002

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Subject:
From:
"Franck, George" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 2 May 2002 10:47:33 -0400
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Greetings,
Has there been any studies published, or stories told, about the ability of
Micro vias to withstand mechanical shear forces in various materials.

For example, consider a 3 mil diameter laser via, thru 2 mil of Speedboard
dielectric material, with .6 to .9 mil of copper plating.  The via is in the
pad of a gold plated finger edge connector.  For a visual picture, imagine
the application is a Game Card for Game Boy, and you are expecting some
physical stress with repeated insertion and extraction.

Would RCC foil be better than the Speedboard, or would you have to use 106
glass prepreg?  Thermont?

Another application would be in a very small 20+ pin multi row SMT
connector.  The connector is 'trapped' by the housing, but insertion and
extraction forces are still transmitted to the board, through the connector
solder joint.  Imagine some Laser vias in those connector pads.

George Franck
who hopes he isn't someplace where no one has gone before.

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