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May 2002

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Subject:
From:
Ed Valentine <[log in to unmask]>
Reply To:
Ed Valentine <[log in to unmask]>
Date:
Wed, 22 May 2002 18:11:25 -0400
Content-Type:
text/plain
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text/plain (57 lines)
Jack -

Back about 20 years ago we use to solder wire-wrap pins into backplanes
using  solder "donuts" and vapor phase soldering. The process worked great.

Ed Valentine
Electronics Manufacturing Solutions
8612 Mourning Dove Road, Raleigh, NC 27615
Phone: (919) 270-5145, Fax: (919) 847-9971
Email: [log in to unmask]
Website: http://www.ems-consulting.com

----- Original Message -----
From: "Jack C. Olson" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, May 22, 2002 11:59 AM
Subject: [TN] ASSY: Reflow for Through-Hole Devices


> One of my colleagues here is thinking their must be some kind of solder
> ring, or collar, or donut shaped thing that you can drop over the leads of
> a (bottom mounted) through-hole device, and then when you reflow the board
> the donuts melt and form a fillet for the PTH device at the same time.
>
> Does anyone do this?
> If this is feasible, where can I find out more (and get a source for the
> solder rings)?
>
> Jack
>
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