Steve,

We are using a Loctite material for underfill of BGAs. It does
significantly improve interconnect reliability in thermal cycling and
vibration.

It is reworkable, and we have proven that reworked BGAs are just as
reliable.

On the down-side, rework is time consuming and it has to be done very
carefully to prevent damage to the PWB. A well controlled process is
essential.

Tom

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