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May 2002

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Subject:
From:
"Jack C. Olson" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 22 May 2002 10:59:26 -0500
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One of my colleagues here is thinking their must be some kind of solder
ring, or collar, or donut shaped thing that you can drop over the leads of
a (bottom mounted) through-hole device, and then when you reflow the board
the donuts melt and form a fillet for the PTH device at the same time.

Does anyone do this?
If this is feasible, where can I find out more (and get a source for the
solder rings)?

Jack

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