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May 2002

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Subject:
From:
"Sauer, Steven T." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 22 May 2002 08:19:57 -0400
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Good Morning Frank,
In answering your questions about side fillets, I'll ask how can you require
a side fillet when side overhang (< W/4) is acceptable?  I don't have a
problem with figure 12-71 as it is depicting side joint length ONLY & does
NOT depict the other required characteristics (i.e. heel fillet) for an
acceptable solder connection.  IMHO the problems arise from one's
interpretation of "evidence of a properly wetted fillet along full length of
lead".  Since toe overhang is acceptable (and does not violate minimum
electrical spacing) how can the fillet extend the full length of the lead?
In summary, for flat ribbons, L and gull wing leads the minimum solder joint
requirements are to have a wetted solder fillet to 75% of the lead width,
75% of the lead length and a heel fillet above the lead thickness.  Every
now and then I wish that common sense would prevail but that is too
uncommon!

Steve Sauer
Mfg Engineer
Northrop Grumman, Xetron

-----Original Message-----
From: Frank Kimmey [mailto:[log in to unmask]]
Sent: Tuesday, May 21, 2002 11:26 AM
To: [log in to unmask]
Subject: Re: [TN] Side fillet requirements
Hey Steve,
If you are watching, what is your take on side fillets?
How do you interpret IPC-610 figure 12-71?

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