In the very early days of surface mount, most footprints allowed for side
fillets to improve solderability. But there were so many problems with
components being skewed and tombstoning during reflow, the most reliable fix
was to remove the side fillet requirement. Now if your customer is
hand-soldering every component, or is epoxying every component in place
before solder, side fillets may have some justification, but beyond that,
tell your customer it is in their best interest to listen to your advice.
Isn't that why they pay you the big bucks?

David Ricketts

Pertek Engineering
Voice: 949-475-4485
Fax:   949-475-4493

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Frank Kimmey
Sent: Monday, May 20, 2002 3:17 PM
To: [log in to unmask]
Subject: [TN] Side fillet requirements


I have a customer who would like us to justify why our IPC-782 compliant
footprints do not allow for a side fillet (pad width is equal to or smaller
than lead width). I did not find conclusive statement in IPC-610 concerning
this. Please help me define acceptance.

Thanks,
FNK

Frank N Kimmey, C.I.D.+
Senior PCB Designer
Powerwave Technologies
PH. 916-941-3159
Fax 916-941-3195

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