No side fillets are usually found on fine-pitch QFP's and the like, where
really there isn't the room to have pads wider than the leads without an
attendant risk of solder bridging. If you have a class 2 product, side
fillets aren't an issue. For class 3, we have to grin and bear it. Toe and
Heel fillets are the important fellows when considering solder joint
strength.

Peter


Frank Kimmey <[log in to unmask]>    21/05/2002 06:16 AM
Sent by: TechNet <[log in to unmask]>

Please respond to "TechNet E-Mail Forum."; Please respond to Frank Kimmey

             To: [log in to unmask]
             cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
             Subject: [TN] Side fillet requirements








I have a customer who would like us to justify why our IPC-782 compliant
footprints do not allow for a side fillet (pad width is equal to or smaller
than lead width). I did not find conclusive statement in IPC-610 concerning
this. Please help me define acceptance.

Thanks,
FNK

Frank N Kimmey, C.I.D.+
Senior PCB Designer
Powerwave Technologies
PH. 916-941-3159
Fax 916-941-3195

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