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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 17 May 2002 11:44:37 -0700 |
Content-Type: | text/plain |
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Bruse,
Yes!
Due to the CTE mismatches between the UR and everything else there is a very real possiblility of edge
peeling.
Run some prototypes before you sign off!!
David A. Douthit
Manager
LoCan LLC
"Misner, Bruce" wrote:
> I have a CM that precision spray coats UR with an x-y programmable gantry
> system. They would like to avoid coating large areas of the board that have
> no components but DOES have conductors covered by solder mask over bare
> copper. The boards are all Class 3, 4 layers, some designs Tin/lead plate
> finish, some solder dipped finish, some .062 thk, some .125 thick.
>
> They are requesting a change of wording on the drawing to read: Coat all
> components, leads, solder joints and exposed circuitry per J-Std-001. Does
> anyone have serious concerns with this approach?
>
> Bruce Misner
>
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