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May 2002

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Subject:
From:
Earl Moon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 2 May 2002 06:36:12 -0400
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Steve,

Some folks know a lot. The reason I included HP: in my post is they study
and plan the heck out of everything and don't develop processes, a long and
intensive process with them, unless it has been proven.

We did the same procedure at Celestica shortly after HP and, again, process
development proved the concept to work very well.

The one really sour not I saw concerned physical component damage from over
vacuuming. I have rarely seen this but seen it I have.

The dessicant can be a safeguard if the bag should spring a pinhole leak for
a short time. Likewise, the moisture indicator, if checked regularly,
provides the information regarding the leak, as an example.

We have, industry has, six different MSD classifications as you know.
Everywhere I've been, that practiced good process management, used the
procedures related to each. You know what they are and the only way you get
there is baking, bagging, tagging, and vacuuming.

Earl
----- Original Message -----
From: <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, May 01, 2002 10:52 PM
Subject: [TN] [TN} Vacuum Sealing...


> Why is this there this disparity? Don't understand it at all..
>
> Why is there so many differing opinions concerning component storage?
>
> Geeze, this is really weird! We don't know about this subject at all, do
we?
>
> -Steve Gregory-
>
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