Good Morning Stu,
Typically, crimp terminals and wires are selected by the circular mil area
(CMA) in cross section of the wire.  CMA is calculated in several different
ways but the most common for solid and stranded wire is to square the
diameter:
CMA=D*D for solid and CMA=D*D*n (n=# of strands) for stranded wire.  I don't
believe the additional tinning will drastically increase the CMA to the
point of an inadequate crimp nor associated pull strength.  Unless your
application (i.e. temperature and current) will see extreme conditions, I
doubt that you would see any reflow of the solder.  My only concern would be
to look at the compatibility and dissimilarity of the metals in the crimp.
The other suggestion would be to contact an applications engineer at the
terminal manufacturer.

Steve Sauer
Mfg Engineer
Northrop Grumman, Xetron

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