Hi,

Does anyone know of criteria for voiding in fine-pitch BGAs after reflow?

IPC-7095 suggests for BGA:

Class I: 60% of dia = 36% of area
Class II: 45% of dia = 20.25% of area
Class III: 30% of dia = 9% of area

Does this apply to fine-pitch components as well? Are there any theories indicating that one can tolerate higher percentage as the balls get smaller?

Thanks,
Hakan Tornqvist

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