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May 2002

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Subject:
From:
Jim Lamb <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 15 May 2002 00:13:34 -0700
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Hi, I am looking for a Rigid printed circuit board reliability model
that is more recent than the MIL-217 or AT&T model. It would include
factors for blind and buried vias as well as soldered and unsoldered
through holes and surface mount solder joints. Usually there is also a
board complexity factor based on the number of layers.

Any suggestions on where to look would be appreciated.

Jim Lamb

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