Earl,
We use all the methods mentioned before, and had good and bad results
occasionally with each of them.
For instance, putting solder paste on the circuit helped for large BGA which
have a warping tendency either because of the carrier or because of the heat
sink.
We also used the mini-printing station, and in this case we had to apply a
little pressure on the part during placement.
I think that there is no rule, best results depend on the rework station and
the part, and operator skill.
TBGA's are my biggest problem, I would like some advice for these parts.
Thank you,
Gaby
----- Original Message -----
From: "Earl Moon" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, May 14, 2002 6:32 PM
Subject: Re: [TN] BGA replacement


> Good points Eric. Also, don't scrape the wick over the pads. Just do the
> touch thing to clean the pads.
>
> MoonMan
>
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