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May 2002

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Subject:
From:
Francis Sun <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 13 May 2002 10:12:36 -0400
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Hi,

I would appreciate any recommendation and/or feedback on solderpaste for a
6 layer double-sided board with CSP & BGA packages.
The smallest aperture size is 0.014 inch dia. for the CSP.
TIA.


Regards;

Frank Sun
IVHS
(905) 624-3025 ext. 1235
Fax: (905) 624-4572

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