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May 2002

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Subject:
From:
Mike Fenner <[log in to unmask]>
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Date:
Mon, 13 May 2002 10:49:53 +0100
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There are no real technical issues in this sense here, the alloys are
interchangeable.
As to why you use it, most people are like you. They do because they do.
I'll say no more - I do not want to re-start the great Sn63 vs. Sn62 debate.

Kind Regards

Mike Fenner

Applications Engineer, European Operations
Indium Corporation
 T: + 44 1908 580 400
M: + 44 7810 526 317
 F: + 44 1908 580 411
 E: [log in to unmask]
W: www.indium.com
Leadfree: www.Pb-Free.com



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Vandendolder, Ron
Sent: Thursday, May 09, 2002 6:27 PM
To: [log in to unmask]
Subject: [TN] 63/37 solder paste with silver plated boards


Dear Technetters,

We would like to change from sn 62/pb/36/ag2  solder paste to standard tin
lead eutectic for silver plated boards. Does anyone know if there are any
issues with silver leaching that would force us to remain with the Ag paste.
We started using the Ag paste years ago and now no one remembers why. The
silver plating on the boards is very thin (immersion 3-8 micro inches).

Regards,

Ron VandenDolder
Telaxis Communications

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