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May 2002

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Subject:
From:
David Fish <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sun, 12 May 2002 09:17:30 -0700
Content-Type:
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text/plain (201 lines)
Dave Hillman

Please explain more about ...

> ... you would be much better off using wetting angle and wetting
geometries metrics.

For instance ...
* What are 'wetting angle and wetting geometries metrics'?
* How are they measured?
* How does measuring of these metrics fit into a higher volume production
plant?

Thank you
Dave Fish

----- Original Message -----
From: "Dave Hillman" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, May 10, 2002 12:33 PM
Subject: Re: [TN] Solder after reflow on Gold Immersion finish


> Hi Bill! Yes, you may see a change in the solder joint appearance with the
> use of the new alternative solderable finishes (e.g. immersion silver,
> immersion gold, immersion tin, immersion palladium) depending on the type
> of reflow profile you are using (inert or not inert, temperatures) and the
> amount of solder paste you deposit (stencil thickness). Provided you have
> acceptable wetting angles and acceptable solder geometries you should not
> have a reliability issue unless you have a solder joint metallurgy issue
> (such as intermetallic embrittlement). Sorry but the days of having a
> "bright and shiny" solder joint are quick fading - they will totally
> disappear when you begin utilizing a NoPb solder process. Having a "bright
> and shiny" solder joint is not good reliability figure of merit - you
would
> be much better off using wetting angle and wetting geometries metrics.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
>
>
> "Brooks,Bill" <[log in to unmask]>@ipc.org> on 05/09/2002 02:09:54 PM
>
> Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please
respond
>        to "Brooks,Bill" <[log in to unmask]>
>
> Sent by:    TechNet <[log in to unmask]>
>
>
> To:    [log in to unmask]
> cc:
>
> Subject:    [TN] Solder after reflow on Gold Immersion finish
>
>
> I'm curious, has anyone seen the solder brightness become dull after
reflow
> when switching from HASL on the board finish to gold immersion? Any idea
> how
> to correct for it?
> -Bill
>
>
> -----Original Message-----
> From: Furrow, Robert Gordon (Bob) [mailto:[log in to unmask]]
> Sent: Thursday, May 09, 2002 10:59 AM
> To: [log in to unmask]
> Subject: Re: [TN] 63/37 solder paste with silver plated boards
>
>
> Ron,
>
> We routinely use eutectic tin lead solder paste with immersion silver
> finished boards with no negative effects. The silver dissolves into the
> molten solder pretty uniformly and the concentration is so low as to not
be
> relevant. The tin/copper intermetallic formation is essentially the same
as
> with HASL or OSP boards.
>
> Thanks,
> Robert Furrow
> Printed Wiring Board Engineer
> Supply Chain Networks
> Lucent Technologies
> 978-960-3224    [log in to unmask]
>
>
> -----Original Message-----
> From: Vandendolder, Ron [mailto:[log in to unmask]]
> Sent: Thursday, May 09, 2002 1:27 PM
> To: [log in to unmask]
> Subject: [TN] 63/37 solder paste with silver plated boards
>
>
> Dear Technetters,
>
> We would like to change from sn 62/pb/36/ag2  solder paste to standard tin
> lead eutectic for silver plated boards. Does anyone know if there are any
> issues with silver leaching that would force us to remain with the Ag
> paste.
> We started using the Ag paste years ago and now no one remembers why. The
> silver plating on the boards is very thin (immersion 3-8 micro inches).
>
> Regards,
>
> Ron VandenDolder
> Telaxis Communications
>
> --------------------------------------------------------------------------
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