Hi Phil! Any issues with soldering to the tin/nickel finish? Is the
assembler using a highly active flux?
Dave Hillman
Rockwell Collins
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Phillip Hinton <[log in to unmask]>@ipc.org> on 05/09/2002 11:39:51 AM
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Subject: [TN] Ceramic filled Teflon board
All
I had an inquiry as to who could supply a 8 layer multilayer for the
Rogers ceramic filled polytetrafluoroethylene laminate for an RF
application. My initial calls did not yield a fabricator.
Also the final finish was tin-nickel. I have not heard of anyone using it
for 20 years. Does anyone still supply it.
Phil Hinton
520-745-1013
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