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May 2002

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Subject:
From:
Richard Carruth <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 9 May 2002 16:48:02 -0500
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Carl,

My interpretation of the 50% vertical and 360 deg. circumference primary and
secondary side barrel fill applies only to class 2 only when ground and
conductor planes act as heat sinks.

I believe this because less than 75% fill is noted as a defect for both class 2
& 3 on page 6-6 and then on page 6-7 class 2 is noted as acceptable for thermal
conditions mentioned yet class 3 is still noted as a defect.

The reality is that if you can not see solder on top side and you have no way of
knowing if the 50% requirement is met then how can you say that it is. You would
have to perform a cross section to really know if the 50% is being met. Now the
question is how many cross sections do you need to have confidence in the solder
meeting the requirement since it can not be visually verified?

Rich




[log in to unmask] on 05/09/2002 01:43:48 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to
      [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: Richard Carruth/LABARGE)

Subject:  [TN] PTH Vertical Fill Requirement IPC610 Rev. C



                Hello,

Looking for the groups opinion(s) on the vertical fill requirement stated on
page 6-7 of IPC-A-610C.

Is the exception pertaining to the Defect Class 3?

Therefore making the 50% fill acceptable for class 3, PROVIDING the 360
degree and 100% wetting of barrel walls lead on the secondary side, and
surrounding PTH's meet the requirements of table 6-2.

What is the opinion of all in the above case "IF" you can not actually see
into the PTH to the depth of the 50%, but the soldering is acceptable and
meets all the requirements otherwise?

Comments privately or to the list will be appreciated.

Thanks,

Carl Barnes
Production Process Analyst

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