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May 2002

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Subject:
From:
Alex Krstic <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 9 May 2002 13:15:49 -0600
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Hi Ron.  Similar situation here.  The board was a standard HASL finish and
Sn62/Pb/36/Ag2 paste was used.  The reason being a ceramic resonator had a Ag
flash coating and silver leaching was a concern.  Now more time is spent in
design to not force the use of Ag content solder by careful part selection.  It
works too, eliminated Ag in our new board.

Alex

-----Original Message-----
From: Vandendolder, Ron [mailto:[log in to unmask]]
Sent: Thursday, May 09, 2002 11:27 AM
To: [log in to unmask]
Subject: [TN] 63/37 solder paste with silver plated boards

Dear Technetters,

We would like to change from sn 62/pb/36/ag2  solder paste to standard tin
lead eutectic for silver plated boards. Does anyone know if there are any
issues with silver leaching that would force us to remain with the Ag paste.
We started using the Ag paste years ago and now no one remembers why. The
silver plating on the boards is very thin (immersion 3-8 micro inches).

Regards,

Ron VandenDolder
Telaxis Communications

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