I'm curious, has anyone seen the solder brightness become dull after reflow
when switching from HASL on the board finish to gold immersion? Any idea how
to correct for it?
-Bill


-----Original Message-----
From: Furrow, Robert Gordon (Bob) [mailto:[log in to unmask]]
Sent: Thursday, May 09, 2002 10:59 AM
To: [log in to unmask]
Subject: Re: [TN] 63/37 solder paste with silver plated boards


Ron,

We routinely use eutectic tin lead solder paste with immersion silver
finished boards with no negative effects. The silver dissolves into the
molten solder pretty uniformly and the concentration is so low as to not be
relevant. The tin/copper intermetallic formation is essentially the same as
with HASL or OSP boards.

Thanks,
Robert Furrow
Printed Wiring Board Engineer
Supply Chain Networks
Lucent Technologies
978-960-3224    [log in to unmask]


-----Original Message-----
From: Vandendolder, Ron [mailto:[log in to unmask]]
Sent: Thursday, May 09, 2002 1:27 PM
To: [log in to unmask]
Subject: [TN] 63/37 solder paste with silver plated boards


Dear Technetters,

We would like to change from sn 62/pb/36/ag2  solder paste to standard tin
lead eutectic for silver plated boards. Does anyone know if there are any
issues with silver leaching that would force us to remain with the Ag paste.
We started using the Ag paste years ago and now no one remembers why. The
silver plating on the boards is very thin (immersion 3-8 micro inches).

Regards,

Ron VandenDolder
Telaxis Communications

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