Dear Technetters,

We would like to change from sn 62/pb/36/ag2  solder paste to standard tin
lead eutectic for silver plated boards. Does anyone know if there are any
issues with silver leaching that would force us to remain with the Ag paste.
We started using the Ag paste years ago and now no one remembers why. The
silver plating on the boards is very thin (immersion 3-8 micro inches).

Regards,

Ron VandenDolder
Telaxis Communications

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