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| From: | |
| Reply To: | (Combined Forum of D-33a and 7-31a Subcommittees) |
| Date: | Tue, 21 May 2002 10:09:46 -0500 |
| Content-Type: | text/plain |
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Colleagues,
Following action items assigned at IPC Expo 2002, the IPC 4-14 Plating Subcommittee has reviewed Table 3-2 from the IPC-6012B for update of thickness requirements for gold, electrodeposited tin, and nickel. The following attachment highlights their recommendations in yellow.
Subsequent review of this Plating Subcommittee markup was done by Lockheed Martin, Sunnyvale, and further recommended changes are indicated in the Class 3 column for electrodeposited tin, gold on areas to be soldered, and nickel electroplate. These latter changes are indicated in blue text within the attached file.
As both the rigid and flex board performance task groups are looking to revise their respective documents, I would like for everyone to review this proposed change and cast their vote for inclusion in the IPC-6012B 2nd Working Draft and the IPC-6013A Interim Final document. Please provide your feedback by Tuesday, May 28, 2002.
Best Regards,
John Perry
Technical Project Manager
IPC
2215 Sanders Road
Northbrook, Il 60062
1-847-790-5318 (P)
1-847-509-9798 (F)
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