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Wed, 8 May 2002 16:45:56 -0500 |
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Do we have a conflict here within the IPC-6012a?
In IPC-6012a, Section 3.5.4.6, it states that exposed copper on areas not to
be soldered is permitted on 1% of the conductor surfaces for Class 3 and 5%
of the surfaces for Class 1 and Class 2.
But, Section 3.8.1 Solder Resist Coverage sub-paragraph a. states "Metal
conductors shall not be exposed or bridged by blisters in areas where solder
resist is required."
The percent allowance issue has been discussed before at Expo 2001 but we did not walk away from that meeting with a clear cut definition of what constitutes X percentage on a board, let alone potential conflict with section 3.8.1.
Best Regards,
John Perry
Technical Project Manager
IPC
2215 Sanders Road
Northbrook, Il 60062
1-847-790-5318 (P)
1-847-509-9798 (F)
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