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April 2002

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Subject:
From:
"Marsico, James" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 8 Apr 2002 13:01:35 -0400
Content-Type:
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Ioan:
We've been using a re-balling system for a few years, now, that we purchased
from HTI Engineering (MA), now Milara, Inc.  It was relatively inexpensive,
less than $5,000, back in 1997.  It's a manual system, using a stencil to
deposit solder paste or paste flux, then another stencil for ball placement.
The company isn't really marketing this system, but is willing to provide
one.  They can be reached at [log in to unmask]
<mailto:[log in to unmask]> , or (508) 359-2786.  If you'd like to discuss
the operation further, please call or e-mail me.

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879


        -----Original Message-----
        From:   Tempea, Ioan [SMTP:[log in to unmask]]
        Sent:   Monday, April 08, 2002 10:35 AM
        To:     [log in to unmask]
        Subject:        [TN] BGA re-balling

        Hi technos,

        I would need info on the various re-balling technologies out there.
Up to
        now I only tried Russ Winslow's preforms.

        Any other way to do it the cheper way, without buying a machine?

        If I should consider buying a machine, what alternatives are there?

        Thanks,
        Ioan


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