We are just about to embark on our first BGA/highspeed design.

Board specification : -

Double Side Surface Mount Board.
With 225 pin 1mm pitch BGA's on each side
Datalines @100Mhz and impedance matched to 50 ohms.
Powerplanes 3V3 and DGND (digital ground)
Military specific applications
Maximum Board Thickness 1.8mm

Could anyone with any experience of the above please comment on the following : -

1.      Layer stack (blind & buried vias?)
2.      Technology (microvias?)
3.      Via size
4.      Track size
5.      Materials

We have been advised that for high speed digital designs that we should limit the
number of vias through ground and powerplanes.

If you have any additional information/comments about the design you feel would be
useful for us, we will be grateful.

In anticipation

Many Thanks



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