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April 2002

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Subject:
From:
"Marsico, James" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 8 Apr 2002 10:42:49 -0400
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Good day, Technet:

Years ago, if one wanted to keep abreast of the latest and greatest designs
and assembly technologies for high reliability military applications, one
would attend the yearly seminars at China Lake.  What conferences would be
recommended nowadays?

Also, if I may be so bold as to address a previous topic (chuckle, chuckle),
with regard to restraining core technology for military products, (Leadless
ceramic components , conduction heat dissipation, etc.) it seems that the
consensus for new designs would be to use a low TCE laminate (Thermount?)
with a compliant bond to an aluminum core.  For you military folks, agree or
disagree?

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879

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