Hi Gary:

Its been a while since we talked.

The flux is applied to the SMT locations after the initial deposit is
flattened. Here is link to the flux being used.

http://www.midwestpcb.com/sales/Kehoe/Ecotack_SP37_SP37i.pdf

At the EASi Assembly Expo 1999 at McCormick Place then ran 3000 Sipad boards
through a fully automatic line.


Robert B. Denbo
MIS / Engineering Manager
Midwest Printed Circuit Services, Inc.
http://www.midwestpcb.com
mailto:[log in to unmask]
847.740.4120
847.740.4187 Fax

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Gary Camac
Sent: Monday, April 08, 2002 5:33 AM
To: [log in to unmask]
Subject: Re: [TN] Any SIPAD users?


Steve,

I would bet you can't feed these on a destacker.  What's is the category of
flux being used?  It is applied on the entire board surface or just at the
soldering locations?

Gary

Gary
----- Original Message -----
From: <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, April 05, 2002 6:33 PM
Subject: [TN] Any SIPAD users?


> Hi All!
>
> I got a few sample boards that a solid solder deposit was applied (SIPAD),
> along with what they call adhesive flux, to play around with. I got some
> dummy components and placed and reflowed them...I was very pleased with
the
> results!
>
> Do any of you use this technology? Any thoughts or opinions would be
> appreciated.
>
> Thanks!!
>
> -Steve Gregory-
>
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