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April 2002

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Subject:
From:
Guenter Grossmann <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 8 Apr 2002 10:09:57 +0200
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Steve

I am not a user but already 5 years ago we made trials with SIPAD and I was impressed, how easy it was to work with that system. We made 50 boards where we placed QFP's with pitch 0.3mm and BGA's with pitch 0.5mm and it was a peace of cake to place these components with a placement machine that was designed for pitch 0.75mm. We also could assemble the boards by hand. As a matter of fact I am trying to get some boards with lead-free deposits.
The one drawback I was told of is the fact that the sticky flux becomes kind of liquid at elevated temperature. One company told me that a container stood in the sone for a weekend and the flux was smeared all over the PCB's.
Apart from that I believe solid solder deposition is a great way to produce SMT.

Have a great day

Guenter



EMPA
Swiss Federal Institute for Materials Testing and Research
Centre for Reliability
Guenter Grossmann,  Senior Enineer

8600 Duebendorf
Switzerland

Phone: xx41 1 823 4279
Fax :     xx41 1823 4054
mail:     [log in to unmask]

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