Steve:

I work for one of the suppliers of Sipad Solid Solder Deposit. If you have
any questions on the Sipad process I will be gladly answer them for you.

The solid solder deposit process is one method to assemble the via in SMT
pad style designs that have been under discussion. By compensating the
volume of solder deposited in those locations we are able to pre-fill the
via prior to assembly.


Robert B. Denbo
Engineering Manager
Midwest Printed Circuit Services, Inc.
http://www.midwestpcb.com
mailto:[log in to unmask]
847.740.4120
847.740.4187 Fax

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of [log in to unmask]
Sent: Friday, April 05, 2002 5:33 PM
To: [log in to unmask]
Subject: [TN] Any SIPAD users?


Hi All!

I got a few sample boards that a solid solder deposit was applied (SIPAD),
along with what they call adhesive flux, to play around with. I got some
dummy components and placed and reflowed them...I was very pleased with the
results!

Do any of you use this technology? Any thoughts or opinions would be
appreciated.

Thanks!!

-Steve Gregory-

----------------------------------------------------------------------------
-----
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET
Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search previous postings at: www.ipc.org > On-Line Resources & Databases >
E-mail Archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
----------------------------------------------------------------------------
-----

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------