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April 2002

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 5 Apr 2002 13:48:38 -0500
Content-Type:
text/plain
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text/plain (90 lines)
Are you free to share your design critera. Were the vias plated through
holes or blind. What was the aspect ratio. Have you really done this on a
0.125" thick board. Remember, that was the question that started this
thread.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Safavi-Bayat Shahed
> Sent: Friday, April 05, 2002 9:57 AM
> To: [log in to unmask]
> Subject: Re: [TN] Via in Pad
>
>
> I used vias in pads on many RF boards and had NO problem
> what so ever. It amuses me a lot, to see these much discussions
> are going on
>
> about this "issue".
>
> Shahed
>
>
>
>
>
>
>
> -----Original Message-----
> From: Bartkowaik Christine [mailto:[log in to unmask]]
> Sent: Friday, April 05, 2002 8:54 AM
> To: [log in to unmask]
> Subject: [TN] Via in Pad
>
>
> Via In Pad's:
> Our R&D group wants to place via's in pads (In the past I have asked them
> NOT to due this).
> Does anyone have success with placing via's in pads based on some known
> Guidelines?
>
> Thanks, Chris
>
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